Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today's complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.
SOI, as the name suggests, consists of a top thin layer of silicon and a bottom thick layer of silicon. An insulator material such as silicon dioxide (SiO2) is placed between these two layers. SOI offers high performance, low power consumption, and high speed compared to traditional silicon wafers. All these factors make it an ideal choice for portable applications such as mobile phones, portable digital assistants (PDAs), notebooks, digital cameras, and others. These wafers were developed in the 1960s for defense and military applications, and the commercialization of these wafers took place gradually
The growth of this market is propelled by the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.
Based on diameters, 200 mm SOI wafers held the largest share of the SOI market in 2017. The market for these wafers is expected to grow at a high rate between 2017 and 2025. 200 mm wafers are mainly used for manufacturing RFSOI wafers, which are further used in smartphones for manufacturing antenna switches and other important components. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. The improvement will be primarily driven by the growth in sales volumes for 300 mm wafers and by controlling production costs on the small diameter line that is running at full capacity. The loading rate of the 300 mm production lines improved significantly, but still remains globally low.
BESOI, ELTRAN, SoS, SiMOX and smart cut are the technology segment of the market. Smart cut technology accounted for the largest share of the SOI market in 2017. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). The licensing of Soitec's Smartcutâ„¢ technology to other companies is anticipated to further increase the SOI wafer supply.
Soitec, the world's leading provider of SOI wafers, has been pioneering the SOI technology. This company accounted for more than 69% of the revenues of the world SOI wafers market in 2017. The other key participants in the SOI wafer market are SunEdison (acquired by Globalwafers Co., Ltd. in 2016), Shin-Etsu Handotai Co. Ltd. and a few others like SUMCO CORPORATION, Ultrasil Corporation and etc. Manufacturer are focusing on strategies such as new product launches, expansions, contracts, and collaborations to enhance their product offerings and expand their business.
The computing and mobile segment accounted for the largest share of the overall SOI market in 2017. Power consumption is one of the burning issues faced by the consumer electronics segment. There are various issues associated with the conventional bulk CMOS technology, such as slow processing speed, high power consumption, low battery life, and soft errors such as data loss caused due to cosmic rays and natural radioactive background signals. The SOI microchip overcomes all these issues and improves the processing speed and performance by up to 30% compared with the CMOS-based chips; it also reduces the power consumption by up to 80%. These features make it ideal for use in computers and cell phones.
Asia-Pacific is predicted to witness the fastest growth over the forecast period owing developing integrated circuit industry. The leading players are emphasizing on modernizing their plants in APAC and fab facilities with advanced technologies. The countries such as China (Taiwan included) and Japan have the largest semiconductor manufacturing base, which is further helping the SOI market grow in this region. The increase in production facilities, rising demand for consumer electronics products, and continuous upgradation and improved efficiency of fab facilities are the key factors driving the growth of the SOI market in APAC.
The key factors restraining the growth of the SOI market are the lack of available IP ecosystem and the floating body effect. The floating body effect is one of the major drawbacks of the SOI devices. It is the dependence of body potential on the history of biasing.
According to this study, over the next five years the Silicon-on-Insulator (SOI) market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Silicon-on-Insulator (SOI) business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Silicon-on-Insulator (SOI) market by product type, application, key manufacturers and key regions and countries.
This study considers the Silicon-on-Insulator (SOI) value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
300 mm SOI
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Automobile and Smart Industry
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Middle East and Africa
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
To study and analyze the global Silicon-on-Insulator (SOI) consumption (value and volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Silicon-on-Insulator (SOI) market by identifying its various subsegments.
Focuses on the key global Silicon-on-Insulator (SOI) manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Silicon-on-Insulator (SOI) with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Silicon-on-Insulator (SOI) submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.
The market engineered data is verified and validated by a number of experts, both in-house and external.
REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.
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